ESP-03: SMD package, built-in ceramic antenna technology, all available IO leads.

Features:

• SDIO 2.0, SPI, UART
• 32-pin QFN package
• Integrated RF switch, balun, 24dBm PA, DCXO, and PMU
• Integrated RISC processor, on-chip memory and external memory interfaces
• Integrated MAC/baseband processors
• Quality of Service management
• I2S interface for high fidelity audio applications
• On-chip low-dropout linear regulators for all internal supplies
• Proprietary spurious-free clock generation architecture
• Integrated WEP, TKIP, AES, and WAPI engines

Solutions:

• Supports APSD for optimal VoIP applications
• Patented spurious noise cancellation algorithm for integration in SOC applications
• Supports Bluetooth co-existence interface
• Self-calibrated RF to ensure optimal performance under all operating conditions
• Zero factory tuning
• No external RF components

Specifications:

• 802.11 b/g/n
• Wi-Fi Direct (P2P), soft-AP
• Integrated TCP/IP protocol stack
• Integrated TR switch, balun, LNA, power amplifier and matching network
• Integrated PLLs, regulators, DCXO and power management units
• +19.5dBm output power in 802.11b mode
• Power down leakage current of <10uA
• Integrated low power 32-bit CPU could be used as application processor
• SDIO 1.1/2.0, SPI, UART
• STBC, 1×1 MIMO, 2×1 MIMO
• A-MPDU & A-MSDU aggregation & 0.4ms guard interval
• Wake up and transmit packets in < 2ms
• Standby power consumption of < 1.0mW (DTIM3)